Analyses of the stability of interfaces between dissimilar materials
When one starts to analyze the evolution of the interfacial reaction product layers between dissimilar materials it is often found out that as the number of interacting species grows, the complexity of the analysis increases extremely rapidly. It may even appear that the task is just too difficult to be completed. In this review we will present the thermodynamic-kinetic method, which can be used to rationalize the evolution of interfacial reaction layers and bring back the physics to the analyses. The method is conceptually very simple. It combines energetics - what can happen - with kinetics - how fast things take place. Yet the method is flexible enough that it can utilize quantitative and qualitative data starting from the atomistic simulations up to the experiments carried out with bulk materials. Thus, the method utilizes a strong combination of experimental and computational work.
Publications (since 2013):
Dong H.Q., Vuorinen V., Liu X.W., Laurila T., Li J., Paulasto-Kröckel M., “Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection”, Journal of Electronic Materials, 45, (1), pp. 566-575, (2016).
Baheti V., Islam S., Narayan R., Ravi R., Kumar P., Hongqun D., Vuorinen V., Laurila T., and Paul A., ”Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)-Sn system”, Philosophical Magazine, 96, (1), pp. 15-30, (2016).
Caro M., Zhang S., Riekkinen T., Ylilammi M., Moram M., Lopez-Acevedo O., Molarius J., and Laurila T., “Piezoelectric coefficients and spontaneous polarization of ScAlN", Journal of Physics: Condensed Matter, 27, pp. 245901-245915, (2015).
Santra S., Sarfaraj I., Raju R., Vuorinen V., Laurila T. and Paul A.,”Phase evolutions in AuCu/Sn system by solid state reactive diffusion”, Journal of Electronic Materials, 43, pp. 3357-3371, (2014).
Laurila T., Karppinen J., Li J., Vuorinen V., and Paulasto-Kröckel M., “Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading”, Journal of Materials Science: Materials in Electronics, 24, pp. 644-653, (2013).